- Place of Origin:Guangdong, China
- Brand Name:Chipskey
- Model Number:#39117
- Warranty:1 Year
- Resolution:500 Dpi
- Certification:ce
- Special Features:Time & Attendance
- Customized support:Customized logo
- Features:sensor
- Attributes:touch
AS606 Fingerprint Module Fingerprint Identification Module Fingerprint Lock Optical Fingerprint Development
1, the working principle
Fingerprint processing involves two processes: fingerprint login process and fingerprint matching process [where fingerprint matching is divided into fingerprint comparison (1:1) and fingerprint search (1:N) two ways).
When fingerprints are registered, each fingerprint is entered twice and the image entered twice is processed. The composite template is stored in the module. When the fingerprints are matched, the fingerprint sensor is used to input the fingerprint image to be verified and processed, and then it is compared with the fingerprint template in the module. (If matching with a template specified in the module, the fingerprint matching method is called 1: 1 mode; if matching with multiple templates, known as the fingerprint search mode, ie 1:N mode), the module gives the matching result (pass or fail).
2, technical parameters
Supply voltage: DC 5V
Supply Current: Operating Current: <120mA Peak Current: <130mA
Fingerprint image entry time: <0.5 seconds
Window area: 18.5mm * 14.6mm
Matching method: comparison method (1:1)
Search method (1:N)
Storage capacity: 200 pieces
Security Level: Level 5 (Low to High: 1, 2, 3, 4, 5) System Default 3
False Acceptance Rate (FAR): <0.001% (Security Level 3)
Rejection Rate (FRR): <1.0% (Security Level 3)
Search time: <1.0 seconds (1:500 hour average)
Resolution: 500dpi
Upper computer interface: UART (TTL logic level)
Communication baud rate (UART): (9600*N)bps where N=1~6 (default N=6, ie 57600bps)
working environment:
Temperature: -25°C-+55°C
Relative humidity: 40%RH-85%RH (without condensation)
Storage environment:
Temperature: -40°C-+85°C
Relative humidity: <90%H (no condensation)
Optical Module (C3) Dimensions (L*W*H): Length 47.65mm* Width 20.50mm* Height 21.20mm
Semiconductor Module Dimensions (L*W*H):
Capacitive module Dimensions: Main control board: length 35mm* width 28mm* height 7mm
Sensor: Length 33.4mm* Width 20.4mm
Scratch type module Dimensions: Main control board: length 35mm* width 28mm* height 7mm
Sensor board: length 24mm* width 20mm* height 5mm
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